Global Semiconductor Assembly and Packaging Services Market, 2025

[KIRAN MANGAVKAR]

Global Semiconductor Assembly and Packaging Services Market, 2025
The Global Semiconductor Assembly and Packaging Services Market size was estimated at USD 6419.40 million in 2023 and is projected to reach USD 8504.51 million by 2030, exhibiting a CAGR of 4.10% during the forecast period.

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