Global Through-Silicon Vias (TSVs) Market 2025

[KIRAN MANGAVKAR]

Global Through-Silicon Vias (TSVs) Market 2025
The Global Through-Silicon Vias (TSVs) Market size was estimated at USD 1796.10 million in 2023 and is projected to reach USD 7563.44 million by 2030, exhibiting a CAGR of 22.80% during the forecast period.

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