Heat Resistant Phenolic Molding Compound Market, Global Outlook and Forecast 2025

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The "Global Heat Resistant Phenolic Molding Compound Market" size was valued at US$ 678.9 million in 2024 and is projected to reach US$ 956.7 million by 2030, at a CAGR of 5.9% during the forecast period 2024-2030.

The "United States Heat Resistant Phenolic Molding Compound Market" size was valued at US$ 189.4 million in 2024 and is projected to reach US$ 256.7 million by 2030, at a CAGR of 5.2% during the forecast period 2024-2030.

By Type
Press Molding Compound
Injection Molding Compound

By Application
Automotive
Aerospace
Electrical & Electronics
Others

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